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专利名称：Microelectronic substrate or element having
conductive pads and metal posts joinedthereto using bond layer
发明人：Belgacem Haba,Chang Myung Ryu,Kimitaka
Endo,Christopher Paul Wade
申请号：US12462208申请日：20090730
公开号：US20100044860A1公开日：20100225
专利附图：
摘要：An interconnection element can include a substrate, e.g., a connection substrate,element of a package, circuit panel or microelectronic substrate, e.g., semiconductor chip,the substrate having a plurality of metal conductive elements such as conductive pads,contacts, bond pads, traces, or the like exposed at the surface. A plurality of solid metalposts may overlie and project away from respective ones of the conductive elements. Anintermetallic layer can be disposed between the posts and the conductive elements, suchlayer providing electrically conductive interconnection between the posts and theconductive elements. Bases of the posts adjacent to the intermetallic layer can bealigned with the intermetallic layer.
申请人：Belgacem Haba,Chang Myung Ryu,Kimitaka Endo,Christopher Paul Wade
地址：Saratoga CA US,Cupertino CA US,Yokohama JP,Los Gatos CA US
国籍：US,US,JP,US
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