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专利名称：Making a plurality of integrated circuit
packages
发明人：Wen Yu Lee,Steven Su申请号：US14965052申请日：20151210公开号：US09363901B2公开日：20160607
专利附图：
摘要：A method of making a plurality of integrated circuit packages provides a metalstrip. A first leadframe having a first die pad is formed on the metal strip. Also formedare a first plurality of leads with proximal ends adjacent to the first die pad, free distal
ends positioned outwardly from the first die pad, and a first leadframe dam bar
intersecting the proximal ends of the first plurality of leads. A second leadframe having asecond die pad, a second plurality of leads with proximal ends adjacent to the second diepad and free distal ends positioned outwardly from the second die pad and a secondleadframe dam bar intersecting the proximal ends of the second plurality of leads areformed on the metal strip. The free distal ends of said second plurality of leads arealigned with and adjacent to said free distal ends of said first plurality of leads.
申请人：Texas Instruments Incorporated
地址：Dallas TX US
国籍：US
代理人：Steven A. Shaw,Frank D. Cimino
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