5-Mar-2011
PACKAGING INFORMATION
Orderable Device
UCC21DUCC21DG4UCC21DRUCC21DRG4UCC21PWUCC21PWG4UCC21PWRUCC21PWRG4UCC22DUCC22DG4UCC22DRUCC22DRG4UCC22PWUCC22PWG4UCC22PWRUCC22PWRG4UCC23D
Status
(1)
Package TypePackage
Drawing
SOICSOICSOICSOICTSSOPTSSOPTSSOPTSSOPSOICSOICSOICSOICTSSOPTSSOPTSSOPTSSOPSOIC
DDDDPWPWPWPWDDDDPWPWPWPWD
Pins1616161616161616161616161616161616
Package Qty
40402500250090902000200040402500250090902000200040
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
Samples(Requires Login)
ACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVE
Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)
CU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
5-Mar-2011
Orderable DeviceUCC23DG4UCC23DRUCC23DRG4UCC23PWUCC23PWG4UCC23PWRUCC23PWRG4UCC24DUCC24DG4UCC24DRUCC24DRG4UCC24PWUCC24PWG4UCC24PWRUCC24PWRG4
(1)
Status
(1)
Package TypePackage
Drawing
SOICSOICSOICTSSOPTSSOPTSSOPTSSOPSOICSOICSOICSOICTSSOPTSSOPTSSOPTSSOP
DDDPWPWPWPWDDDDPWPWPWPW
Pins161616161616161616161616161616
Package Qty
4025002500909020002000404025002500909020002000
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
Samples(Requires Login)
ACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVE
Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)Green (RoHS& no Sb/Br)
CU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIMCU NIPDAULevel-1-260C-UNLIM
The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
5-Mar-2011
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availabilityinformation and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms \"Lead-Free\" or \"Pb-Free\" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement thatlead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used betweenthe die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines \"Green\" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weightin homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGEMATERIALSINFORMATION
www.ti.com
4-Mar-2011
TAPEANDREELINFORMATION
*Alldimensionsarenominal
Device
PackagePackagePinsTypeDrawingSOICTSSOPSOICTSSOPSOICTSSOPSOICTSSOP
DPWDPWDPWDPW
1616161616161616
SPQ
ReelReelA0DiameterWidth(mm)(mm)W1(mm)330.0330.0330.0330.0330.0330.0330.0330.0
16.412.416.412.416.412.416.412.4
6.56.96.56.96.56.96.56.9
B0(mm)10.35.610.35.610.35.610.35.6
K0(mm)2.11.62.11.62.11.62.11.6
P1(mm)8.08.08.08.08.08.08.08.0
WPin1(mm)Quadrant16.012.016.012.016.012.016.012.0
Q1Q1Q1Q1Q1Q1Q1Q1
UCC21DRUCC21PWRUCC22DRUCC22PWRUCC23DRUCC23PWRUCC24DRUCC24PWR
25002000250020002500200025002000
PackMaterials-Page1
PACKAGEMATERIALSINFORMATION
www.ti.com
4-Mar-2011
*Alldimensionsarenominal
DeviceUCC21DRUCC21PWRUCC22DRUCC22PWRUCC23DRUCC23PWRUCC24DRUCC24PWR
PackageType
SOICTSSOPSOICTSSOPSOICTSSOPSOICTSSOP
PackageDrawing
DPWDPWDPWDPW
Pins1616161616161616
SPQ25002000250020002500200025002000
Length(mm)
333.2346.0333.2346.0333.2346.0333.2346.0
Width(mm)345.9346.0345.9346.0345.9346.0345.9346.0
Height(mm)
28.629.028.629.028.629.028.629.0
PackMaterials-Page2
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