vsmb2000

VSMB2000X01, VSMB2020X01

Vishay Semiconductors

High Speed Infrared Emitting Diodes, 940 nm, GaAlAs, DH

FEATURES

VSMB2000X01 VSMB2020X01

21725-1

DESCRIPTION

VSMB2000X01 series are infrared, 940 nm emitting diodesin GaAlAs (DH) technology with high radiant power and highspeed, molded in clear, untinted plastic packages (with lens)for surface mounting (SMD).

•••••••••••••••

Package type: surface mountPackage form: GW, RGW

Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.8AEC-Q101 qualified

Peak wavelength: λp = 940 nmHigh reliability

High radiant powerHigh radiant intensity

Angle of half intensity: ϕ = ± 12°Low forward voltage

Suitable for high pulse current operation

Terminal configurations: gullwing or reserve gullwingPackage matches with detector VEMD2000X01 seriesFloor life: 4 weeks, MSL 2a, acc. J-STD-020

Compliant to RoHS directive 2002/95/EC and inaccordance to WEEE 2002/96/EC

•Halogen-free according to IEC 61249-2-21 definition

•Find out more about Vishay’s Automotive Grade Productrequirements at: www.vishay.com/applicationsAPPLICATIONS

••••••

IrDA compatible data transmissionMiniature light barrierPhotointerruptersOptical switch

Control and drive circuitsShaft encoders

PRODUCT SUMMARY

COMPONENTVSMB2000X01VSMB2020X01

Ie (mW/sr)

4040

ϕ (deg)± 12± 12

λP (nm)940940

tr (ns)1515

Note

Test conditions see table “Basic Characteristics“

ORDERING INFORMATION

ORDERING CODEVSMB2000X01VSMB2020X01

Note

MOQ: minimum order quantity

PACKAGINGTape and reelTape and reel

REMARKS

MOQ: 6000 pcs, 6000 pcs/reelMOQ: 6000 pcs, 6000 pcs/reel

PACKAGE FORMReverse gullwing

Gullwing

ABSOLUTE MAXIMUM RATINGS

PARAMETERReverse voltageForward currentPeak forward currentDocument Number: 81930Rev. 1.2, 23-Jul-09

tp/T = 0.5, tp = 100 µsTEST CONDITION

SYMBOL

VRIFIFM

VALUE5100200

For technical questions, contact: emittertechsupport@vishay.comwww.vishay.com

1UNITVmAmA

VSMB2000X01, VSMB2020X01

Vishay SemiconductorsHigh Speed Infrared Emitting Diodes,

940 nm, GaAlAs, DH

ABSOLUTE MAXIMUM RATINGS

PARAMETERSurge forward currentPower dissipationJunction temperatureOperating temperature rangeStorage temperature rangeSoldering temperature

Thermal resistance junction/ambientNote

Tamb = 25 °C, unless otherwise specified

1801201008060TEST CONDITION

tp = 100 µs

SYMBOLIFSMPVTjTambTstg

VALUE1160100- 40 to + 85- 40 to + 100

260250

UNITAmW°C°C°C°CK/W

t ≤ 5 s

J-STD-051, leads 7 mm,

soldered on PCB

TsdRthJA

PV - Power Dissipation (mW)160140120100806040200010203040506070809010021344RthJA = 250 K/WIF - Forward Current (mA)RthJA = 250 K/W40200010203040506070809010021343Tamb - Ambient Temperature (°C) Fig. 1 - Power Dissipation Limit vs. Ambient TemperatureTamb - Ambient Temperature (°C) Fig. 2 - Forward Current Limit vs. Ambient Temperature

BASIC CHARACTERISTICS

PARAMETERForward voltage

Temperature coefficient of VFReverse currentJunction capacitanceRadiant intensityRadiant power

Temperature coefficient of radiant power

Angle of half intensityPeak wavelengthSpectral bandwidth

Temperature coefficient of λpRise timeFall timeCut-off frequencyVirtual source diameter

Note

Tamb = 25 °C, unless otherwise specified

www.vishay.com2

For technical questions, contact: emittertechsupport@vishay.comDocument Number: 81930

Rev. 1.2, 23-Jul-09

IF = 30 mAIF = 30 mAIF = 30 mA

IF = 100 mA, 20 % to 80 %IF = 100 mA, 20 % to 80 %IDC = 70 mA, IAC = 30 mA pp

TEST CONDITIONIF = 100 mA, tp = 20 msIF = 1 A, tp = 100 µs

IF = 1 mAIF = 100 mAVR = 5 V

VR = 0 V, f = 1 MHz, E = 0 mW/cm2

IF = 100 mA, tp = 20 msIF = 1 A, tp = 100 µsIF = 100 mA, tp = 20 ms

IF = 1 mAIF = 100 mA

SYMBOL

VFVFTKVFTKVFIRCJIeIeφeTKφeTKφeϕλpΔλTKλptrtffcd

92020

704040040- 1.1- 0.51± 12940250.251515231.5

96060

MIN.1.15

TYP.1.352.2- 1.8- 1.1

10MAX.1.6

UNITVVmV/KmV/KµApFmW/srmW/srmW%/K%/Kdegnmnmnm/KnsnsMHzmm

VSMB2000X01, VSMB2020X01

High Speed Infrared Emitting Diodes, Vishay Semiconductors

940 nm, GaAlAs, DH

BASIC CHARACTERISTICS

Tamb = 25°C, unless otherwise specified

1000180Ie rel - Relative Radiant Intensity (%)IF = 1 mA160140120IF = 100 mA1008060tp = 20 ms40- 60- 40- 20020406080100IF - Forward Current (mA)10010tp = 100 µstp/T= 0.0011012321534VF - Forward Voltage (V)21444Tamb - Ambient Temperature (°C)Fig. 3 - Forward Current vs. Forward VoltageFig. 6 - Relative Radiant Intensity vs. Ambient Temperature

110VF, rel - Relative Forward Voltage (%)10010810610410210096949290- 40- 20020tp = 20 msIF = 1 mAIF = 100 mAIF = 10 mAΦe rel - Relative Radiant Power (%)908070605040302010084088092096010001040IF = 30 mA4060801002144521443Tamb - Ambient Temperature (°C)λ - Wavelength (nm)Fig. 4 - Relative Forward Voltage vs. Ambient TemperatureFig. 7 - Relative Radiant Power vs. Wavelength

0°100010°20°30°Ie - Radiant Intensity (mW/sr)10040°1.050°0.960°0.870°0.780°0.60.40.201012148710100100021550IF - Forward Current (mA)Fig. 5 - Radiant Intensity vs. Forward CurrentFig. 8 - Relative Radiant Intensity vs. Angular Displacement

Document Number: 81930Rev. 1.2, 23-Jul-09

For technical questions, contact: emittertechsupport@vishay.comwww.vishay.com

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ϕ - Angular Displacementtp = 100 µstp/T= 0.001Ie rel - Relative Radiant Intensity

VSMB2000X01, VSMB2020X01

Vishay SemiconductorsHigh Speed Infrared Emitting Diodes,

940 nm, GaAlAs, DH

SOLDER PROFILE

300250255 °C240 °C217 °Cmax. 260 °C245 °CDRYPACK

Devices are packed in moisture barrier bags (MBB) toprevent the products from moisture absorption duringtransportation and storage. Each bag contains a desiccant.

Temperature (°C)200max. 30 s150max. 120 s100500050100150200250300max. ramp up 3 °C/smax. ramp down 6 °C/smax. 100 sFLOOR LIFE

Floor life (time between soldering and removing from MBB)must not exceed the time indicated on MBB label: Floor life: 4 weeks

Conditions: Tamb < 30 °C, RH < 60 %

Moisture sensitivity level 2a, acc. to J-STD-020.

DRYING

Time (s)19841Fig. 9 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020

In case of moisture absorption devices should be bakedbefore soldering. Conditions see J-STD-020 or label.Devices taped on reel dry using recommended conditions192 h at 40 °C (+ 5 °C), RH < 5 %.

PACKAGE DIMENSIONS in millimeters: VSMB2000

0.4Ø 1.8± 0.10.05 ± 0.1Z2.77 ± 0.21.62.22.25.8 ± 0.22.3 ± 0.2exposed copper0.30.19Z 20:11.1 ± 0.10.52.3 ± 0.20.4CathodePin IDAnode1.70.75Solder pad proposal acc. IPC 7351technical drawingsaccording to DINspecificationsNot indicated tolerances ± 0.1Ø 2.3 ± 0.16.7Drawing-No.: 6.544-5391.02-4Issue: 1; 26.09.0821517 www.vishay.com4

For technical questions, contact: emittertechsupport@vishay.comDocument Number: 81930

Rev. 1.2, 23-Jul-09

0.254

VSMB2000X01, VSMB2020X01

High Speed Infrared Emitting Diodes, Vishay Semiconductors

940 nm, GaAlAs, DH

PACKAGE DIMENSIONS in millimeters: VSMB2020

0.4Ø 1.82.77 ± 0.2X1.60.052.20.192.24.2 ± 0.2exposed copper0.3X 20:12.3 ± 0.20.52.3 ± 0.20.40.6CathodePin IDAnode0.75Solder pad proposal acc. IPC 7351technical drawingsaccording to DINspecificationsNot indicated tolerances ± 0.12.455.15Drawing-No.: 6.544-5383.02-4Issue: 3; 26.09.0821488

Document Number: 81930Rev. 1.2, 23-Jul-09

For technical questions, contact: emittertechsupport@vishay.comwww.vishay.com

5

0.254

VSMB2000X01, VSMB2020X01

Vishay SemiconductorsHigh Speed Infrared Emitting Diodes,

940 nm, GaAlAs, DH

TAPING AND REEL DIMENSIONS in millimeters: VSMB2000

ReelUnreel directionXØ 62± 0.52.5 0.5±Tape positioncoming out from reel6000 pcs/reelØ 330± 1Ø13± 0.5Label posted here12.4± 1.5Technical drawings according to DINspecificationsLeader and trailer tape:Empty (160 mm min.)Parts mountedDirection of pulling outEmpty (400 mm min.)1.75± 0.1Document Number: 81930

Rev. 1.2, 23-Jul-09

Terminal position in tapeDevice Lead I Lead IIVEMT2000Collector EmitterVEMT2500VEMD2000Cathode AnodeVSMB2000Ø 1.55± 0.05IX 2:14 ± 0.12± 0.053.05± 0.1II4 ± 0.1Drawing-No.: 9.800-5100.01-4Issue: X; 29.04.0921572www.vishay.com6

For technical questions, contact: emittertechsupport@vishay.com5.5± 0.05

12± 0.3

VSMB2000X01, VSMB2020X01

High Speed Infrared Emitting Diodes, Vishay Semiconductors

940 nm, GaAlAs, DH

TAPING AND REEL DIMENSIONS in millimeters: VSMB2020

ReelUnreel directionX2.Ø 62± 0.55 0.5±Tape positioncoming out from reel6000 pcs/reelØ 330± 1Ø13± 0.5Label posted here12.4 ± 1.5technical drawings according to DINspecificationsLeader and trailer tape:Empty (160 mm min.)Parts mountedDirection of pulling outEmpty (400 mm min.)1.75± 0.15.5± 0.05

Document Number: 81930Rev. 1.2, 23-Jul-09

For technical questions, contact: emittertechsupport@vishay.comwww.vishay.com

7

Terminal position in tapeDevice Lead I Lead IIVEMT2020VEMT2520VSMB2020Cathode AnodeVEMD2020Collector EmitterØ 1.55± 0.05IX 2:14 ± 0.12 ± 0.053.05 ± 0.1II4± 0.1Drawing-No.: 9.800-5091.01-4Issue: X; 29.04.092157112± 0.3Legal Disclaimer Notice

Vishay

Disclaimer

All product specifications and data are subject to change without notice.

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained hereinor in any other disclosure relating to any product.

Vishay disclaims any and all liability arising out of the use or application of any product described herein or of anyinformation provided herein to the maximum extent permitted by law. The product specifications do not expand orotherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressedtherein, which apply to these products.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by thisdocument or by any conduct of Vishay.

The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unlessotherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in suchapplications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resultingfrom such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regardingproducts designed for such applications.

Product names and markings noted herein may be trademarks of their respective owners.

Document Number: 91000Revision: 18-Jul-08

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